The webinar will introduce the principles of thermal transient testing – as a general method of semiconductor package characterization by means of physical measurement.

The unique thermal transient results, post-processing technology resulting in structure functions, and dynamic compact thermal models of packages will also be covered. The new de facto standard of the junction-to-case thermal resistance (RthJC) measurement of power semiconductors – such as power LEDs – based on the so called dual interface method will be shown. This method is also based on structure functions and it is likely to become a new JEDEC standard.

What You Will Learn

• How to measure thermal characteristics of power LEDs, LED lines and assemblies such as an RGB module
• How to perform structural analysis of power LED packages using structure functions
• How to generate compact thermal models of power LED packages to be used e.g. in CFD simulation
• How to perform measurement of the temperature dependence of light output metrics of LEDs