The complimentary seminar will address contemporary electronics thermal management design challenges for a variety of applications.

This seminar looks into novel approaches and methodology in the use of the latest computational fluid dynamics (CFD) capabilities available with FloTHERM and related solutions to assist engineers.

Topics and examples discussed in this seminar:

• Consumer Electronics: Engineering challenges vs consumer experience and perception tradeoffs
  • Hand held study: Predicting accurate transient response to user scenarios. Are phase change materials effective at shielding transient heating from consumer?
  • Set Top study: Are Vent holes effective for Fan-less boxes? Options are explored
• Telecoms Industry: Demanding environments and commercial pressures
  • Blade Server Study: Off the shelf heat sinks are rarely adequate and never optimal for real world scenarios. Studies to optimize heat sink thermal performance will be described as part of a holistic board level approach.
  • Outdoor Enclosures Study: Through application of a proprietary method using BottleNeck (Bn) and ShortCut (Sc) numbers thermal design can be driven toward increased thermal performance and reduce material cost in an innovative way.

• Thermal Design Engineers
• Packaging Engineers
• Mechanical Engineers