|
The most common method for cooling electronics assemblies is best classified as forced convection cooling. The alternative classifications are natural convection (passive) cooling and radiative cooling (such as used in space-based applications). Forced convection cooling typically involves air being moved through a system by a fan, and the air removes the heat from the system via convection.
This web seminar is the second in a two-part series and will address:
- Simulations settings, including solver choices
- Convergence criteria
- Viewing important results (in unique ways)
- Sanity checks (including expected variations due to changes such as altitude variations)
Specific examples will be used to visualize and demonstrate the steps.
This seminar is targeted to engineers and designers either looking at or already performing thermal simulations of electronics assemblies.
This webinar is free, but registration is required to obtain log-in credentials.
10am (London) • 11am (Berlin/Paris) • 3:30pm (Bangalore) > Register
10am (Los Angeles) • 1pm (New York) > Register
| 
]
