Understanding the thermal behaviour and associated structural response of a component is crucial to the design of an electronics product. From initial concept through to manufacturing, ANSYS simulation plays its part in helping engineers eliminate under-performing proposals, while also providing non-invasive methods for performance assessments of potential designs.

• Thermal analysis
• Joule / resistive heating
• Transient heat-up and cool-down
• Structural response
• Thermal induced stresses and deformations
• High Acceleration, Shock and Impact Loadings
• Multiphysics analysis coupling electromagnetics simulation, CFD and FEA - including the leading ANSYS Maxwell, Icepak, and Mechanical solvers
• Model parameterisation for geometric dimensions and operational conditions
• Modelling of fans, heat sinks, fins and other components within an electronics assembly
• Integration with external CAD

To register, or for further information, please visit: http://wildeanalysis.co.uk/events/2015/simulations -for-thermal-and-structural-response-of-electronic -components

Alternatively, please contact us on 0161 474 7479 or email events@wildeanalysis.co.uk