TASPCB is the revolutionary new thermal analysis software for printed circuit
boards from Harvard Thermal. Increasing board densities and higher
power dissipation require an accurate and thorough thermal analysis to insure
the reliability of today's electronics. TASPCB enables companies to
quickly and easily analyze the thermal design of their boards and address
thermal management issues early in the design stage; dramatically reducing
the time and expense of building prototypes.
TASPCB imports all the data from industry recognized ECAD tools and generates
an accurate representation of the board including traces, vias, power and
ground planes and true board shape. Using SmartMapping technology,
TASPCB cross references the data to the built-in component library to generate
accurate 3D representations of the components. Predicting heat transfer
and air flow across the board is accomplished by the integrated CFD solver
developed by Harvard Thermal. The air and the board are automatically
and independently meshed for optimum solution of each domain and optimum
solution speed. Results can be viewed graphically or in tabular format
to identify over temperature-components. Components can be simply drag
and dropped and heat sinks added to solve problems. TASPCB models can be
exported to TAS, Ansys, NASTRAN, and FEMAP for system level analysis.
Harvard Thermal is located in Harvard, Massachusetts. The company provides
cutting edge software solutions for thermal management as well as thermal,
structural and fluid flow consulting services. For additional information
on Harvard Thermal or the other software products and services they offer,
please visit their web site at www.HarvardThermal.com or call (978) 772-3800.
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