According to Dr. Jan Visser, President of Qfinsoft, “Qfin has been developed as a heat sink design and optimization tool to cut the time and effort involved in designing optimized heat sinks. Along with a completely new design interface, a more advanced network solver that can solve multiple fans on the same heat sink, Qfin’s accuracy over a wide range of complex heat sink geometries has been improved.

“We’re glad to see Qfinsoft respond to the customer needs in advancing the capabilities of Qfin. The completely redesigned interface and ease of working with heat sink configurations combined with the speed of optimization makes this a valuable tool in the arsenal of thermal design engineers to meet the challenges of producing quick, reliable, and robust designs," adds Icepak’s Global Business Manager Prabhu Sathyamurthy. A quick estimation of optimum heat sink characteristics cuts down the design time at the device, component, and system levels, and adds design effectiveness. By quickly evaluating a number of design options, engineers can deliver more reliable designs in a shorter period of time.” “Our mission,” Sathyamurthy continues, “is to provide the best suite of products to address the critical needs of the electronics industry.”