“Icepak division of Fluent is focused on delivering the best-in-class suite of design tools to the electronics industry” says Prabhu Sathyamurthy, Director of Icepak division. “This partnership between Fluent and Harvard Thermal will benefit customers seeking detailed thermal design of IC packages, which are becoming increasingly complex in functionality and layout. Icechip is designed to perform detailed thermal analysis inclusive of IC package substrates, traces, vias, non-uniform heat generation, wire bonds, and solder balls. It will also be able to handle all varieties of IC package types including wirebond and flipchip BGAs, stacked die configurations, and Multi-Chip Modules (MCMs).”

Detailed thermal design is a critical challenge in improving the performance and reliability of these devices. Harvard Thermal's direct interface to ECAD tools such as Cadence's APD and Synopsys' Encore and its expertise in thermal solutions of the board and component levels makes this technology very attractive to fit into the vision of a seamless design layout and analysis flow in the electrical, mechanical, and thermal characterization of packages, printed circuit boards, and system.

“Our unique methodology to generate models for complex IC packages gives tremendous depth and flexibility. This flexibility ensures users can handle any package style today and in the future,” said David Rosato, president of Harvard Thermal. “We are pleased to enter into this partnership with Fluent in this industry. The customers will clearly benefit from the use of our technology and its marriage with Fluent's technologies in Icepak. Icechip will dramatically reduce the analysis and characterization process and ensures accuracy by capturing the true geometry generated directly from the EDA software used in the package design process.”

Pricing and Availability